In the high-stakes world of hardware engineering, the project code-named "Aeon Link" was the ultimate puzzle. It wasn't just a device; it was a three-dimensional logic sandwich designed to fit into the sleek, curved handle of a next-gen surgical laser. The Architecture Lead designer Elena stared at her screen, where three distinct PCBs hovered in virtual space. The Power Floor: A heavy, four-layer board packed with voltage regulators and heat sinks. It was the brute force, handling the raw juice. The Neural Core: A high-density interconnect (HDI) board with a 1,000-pin FPGA. This was the brain, whispering commands at gigahertz speeds. The Sensor Roof: A flexible circular board that sat just behind the lens, populated with delicate optical receivers. The Mechanical Waltz The challenge wasn't just electrical; it was a spatial nightmare. "We have three millimeters of clearance between the Core and the Power Floor," the mechanical lead, Marcus, warned. "If a capacitor is too tall, the casing won't snap shut." They used
Moving to a multi-board environment introduces several layers of complexity: Interactive Routing Datasheet - Altium Resources multi-board design