Datacon Die Bonder

| Feature | DataCon (High-Mix Bonder) | High-Volume Bonder | |---------|---------------------------|--------------------| | | Minutes (recipe-driven) | Hours (mechanical) | | Minimum order quantity | 1–100 units | 10k+ units | | Capital cost | Low to moderate | Very high | | Die size range | Very wide (0.2mm to >20mm) | Narrow (optimized) | | Substrate types | Ceramic, PCB, leadframe, flex | Mostly leadframe or strip |

He restarted the cycle.

He put the machine into "Manual Maintenance Mode" and cracked the security seal on the glass door. The heat hit him instantly, smelling of ozone and cured epoxy. datacon die bonder